Manos M. Tentzeris

Manos M. Tentzeris

Professor

School of Electrical and Computer Engineering

Email: etentze@ece.gatech.edu

Website: ece.gatech.edu/directory/emmanouil-m-tentzeris

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Keywords: materials, devices

Degrees:

  • PD in Mechanical Engineering, University of California, Berkeley
  • MS in Electrical Engineering, University of California, Berkeley

Bio

Manos M. Tentzeris is Ed and Pat Joy Chair Professor. From 2016-2023, he served as Ken Byers Professor in the area of flexible electronics with the School of ECE, Georgia Tech and he has published more than 850 papers in refereed Journals and Conference Proceedings, 5 books and 25 book chapters.

His research interests include:

  • 3D-Printed/Inkjet-Printed RF/5G+/mmW/subTHz Electronics, Antennas, Modules and Sensors
  • "Green" and sustainable energy harvesting (e.g. RF, mechanical, thermal, UV)
  • Nanotechnology-based AI/ML-enabled Ultrasensitive Wireless Sensors
  • Ultra-Long Range "Zero-Power" Communication Systems
  • Morphing (Shape Changing)/Origami Phased Antenna Arrays and 4D RF Modules with Shape-Changing (Morphing) Characteristics
  • Flexible Hybrid Electronics & 3D Modules up to mm-wave/sub-THz Frequency-range
  • Wearable and Implantable Wireless Body-Area Networks
  • "Smart Skin", "Zero-Power" and "Smart Energy" Applications
  • Wireless Power Transfer and Localization Applications
  • Real-Time Multiresolution Algorithms for the Analysis and Design of Wireless Communication Front-Ends
  • Novel RFID/mmID Antennas/Architectures
  • Adaptive Transient Analysis of Active Circuits

Honors & Awards

Dr. Tentzeris has served as the Georgia Electronic Design Center Associate Director for RFID/Sensors research from 2006-2010 and as the GT-Packaging Research Center (NSF-ERC) Associate Director for RF research and the leader of the RF/Wireless Packaging Alliance from 2003-2006. Also, Dr. Tentzeris is the Head of the A.T.H.E.N.A. Research Group (20 students and researchers) and has established academic programs in 3D Printed RF electronics and modules, flexible electronics, origami and morphing electromagnetics, Highly Integrated/Multilayer Packaging for RF and Wireless Applications using ceramic and organic flexible materials, paper-based RFIDs and sensors, inkjet-printed electronics, nanostructures for RF, wireless sensors, power scavenging and wireless power transfer, Microwave MEM's, SOP-integrated (UWB, mutliband, conformal) antennas and Adaptive Numerical Electromagnetics (FDTD, MultiResolution Algorithms). He was the 1999 Technical Program Co-Chair of the 54th ARFTG Conference and he is currently a member of the technical program committees of IEEE-IMS, IEEE-APS and IEEE-ECTC Symposia. He was the TPC Chair for the IMS 2008 Conference and the Co-Chair of the ACES 2009 Symposium. He was the General Co-Chair of the 2023 IEEE Wireless Power Technology Conference and Expo (WPTCE) in San Diego and of the 2019 IEEE APS Symposium in Atlanta and the Chairman for the 2005 IEEE CEM-TD Workshop. He was the Chair of IEEE-CPMT TC16 (RF Subcommittee) and he was the Chair of IEEE MTT/AP Atlanta Sections for 2003. He is a Fellow of IEEE, a member of MTT-15 Committee, an Associate Member of European Microwave Association (EuMA), a Fellow of the Electromagnetics Academy, and a member of Commission D, URSI and of the the Technical Chamber of Greece. He is the Founder and the inaugural Chair of IEEE MTT-S TC-24 (RFID Technologies). He is one of the IEEE EPS Distinguished Lecturers and he has served as one IEEE CRFID Distinguished Lecturer and as one IEEE MTT-Distinguished Microwave Lecturers (DML).